TB2086M fast-curing low temperature type adhesive is a set with a main agent and curing agent. It can even cure at a low temperature of -5°C. It is good for bonding various metals, plastics, and rubber, etc.
Features:
•Mix ratio 1:1
•Rapid setting within minutes at room temperature
•Low viscosity mixed resin with excellent flowability
•The cured resin excels in electric properties, mechanical strength and chemical resistance
•Bonds a wide range of materials including metals, engineered plastics, ceramics, stone, wood, FRP and rubbers
•Low temperature 5 deg C setting capability
Applications:
• Electronics Bonding/Sealing
•Potting/Encapsulation
•Structural Bonding
